View ACPF-7001-TR1_1205497.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Agilent ACPF-7001 High Rejection Tx Filter for US PCS Band
Data Sheet
Features * High rejection from a single filter with no switches required * Passband: 1850 -1910 MHz 33 dB min Attenuation, 1930 - 1990 MHz 3.5 dB max Insertion Loss
3
Description This product is a high rejection full band transmit filter designed for US PCS handsets. Its performance rivals splitband surface acoustic wave (SAW) transmit filters. Since the rejection is provided by a single filter, no switches are required, saving board space and external components, eliminating switch loss, and reducing programming complexity. In typical cellular phone architectures, the transmit filter fits between the driver amplifier and the power amplifier. This filter reduces the noise in the Rx band being amplified by the transmit chain, enhancing receiver sensitivity. High rejection keeps unwanted signals out of the receive path. Agilent's thin-Film Bulk Acoustic Resonator (FBAR) technology makes possible high-Q filters at a fraction of their usual size.
Package
1 2
3.0 0.15 SQ
8
9
4
* Space saving solution Small footprint: 3 x 3-mm solution Low profile package: 1.0 mm high (typ) 1.15 mm (max)
7
6
5
Applications * US PCS band handsets * Wireless data terminals
4: Input 8: Output 1, 2, 3, 5, 6, 7, 9: Grounded Center pad grounded See Figure 10 for details. "x" = date code character
Electrical Specifications, ZO = 50
Symbol
f IL IL IL S21 S21 S21 S21 S21 S11, S22 Pin max
Parameter
Passband Insertion Loss 1850-1855 MHz Insertion Loss 1855-1905 MHz Insertion Loss 1905-1910 MHz Ripple, 1850-1910 MHz Min Rejection, 1930-1990 MHz Min Rejection, 10-1800 MHz Min Rejection, 1990-3820 MHz Min Rejection, 3820-5730 MHz In-band Return Loss Safe Input Power Level
Units
MHz dB dB dB dB dB dB dB dB dB dBm
25C Min Typ Max
1850 2.0 1.5 2.5 1910 3.5 3.0 3.5 2.5 33 25 30 15 9.0 20 11 37
-30 to +25C Min Typ Max
1850 1910 3.7 3.0 3.2
25 to +70C Min Typ Max
1850 1910 3.2 3.0 3.7
33
33
9.0 20
11
9.0 20
11
Absolute Maximum Ratings [2] Parameter
Operating Temperature[1] Storage Temperature[1]
Unit
C C
Value
-30 to +85 -30 to +100
Notes: 1. Temperature is defined at case TC, the temperature of the underside of the filter where it makes contact with the circuit board. 2. Specifications are guaranteed over the given temperature range. Operation in excess of any one of these conditions may result in permanent damage to the device.
Typical Performance, 25C, ZO = 50
0
0
-10
-1
ATTENUATION (dB)
ATTENUATION (dB)
-20
-2
-30
-3
-40
-4
-50 1.7
1.80
1.90 FREQUENCY (GHz)
2.00
2.10
-5 1.83
1.85
1.87
1.89
1.91
1.93
FREQUENCY (GHz)
Figure 1. Attenuation vs. Frequency.
0
Figure 2. Insertion Loss vs. Frequency.
0
-10
ATTENUATION (dB)
RETURN LOSS (dB)
-4
-20
-8
-30
-12
-40
-16
-50 0 1.0 2.0 3.0 4.0 5.0 6.0 FREQUENCY (GHz)
-20 1.83
1.85
1.87
1.89
1.91
1.93
FREQUENCY (GHz)
Figure 3. Attenuation vs. Frequency (Broadband).
Figure 4. Return Loss vs. Frequency.
2
PCB Interface and Mounting Instructions
Mounting Consideration and Board Description The ACPF-7001 filter has one input (Pin 4), one output (Pin 8) and 6 grounds (Pins 1, 2, 3, 5, 6, 7). Furthermore, the inside of the filter (center pad Pin 9) is ground-plane; therefore it must be soldered to PCB ground. In summary: * Pins 1, 2, 3, 5, 6, 7, 9 are grounded. (Figure 5) * Demo board uses 10 mil top, 18 mil bottom Greek Coplanar Waveguide Over Ground plane (CPWG) style board. (See board layer Figure 5, 6) Note: For best performance, try to reproduce this board stack up closely. The demoboard uses CPWG transmission lines for high isolation between two ports. It uses via holes to connect the CPWG line from the underside of the board to the filter mounting pads on top. If Ground-SignalGround (GSG) type board is used, better return loss can be achieved since it eliminates connector mismatch. Demo Boards SMA connectorized Demo boards are available for sampling. (See board drawing in Figure 5).
Figure 6b. Board stack up description. Figure 5. PCB top and bottom views (vias used to connect the underside of the board to the filter mounting pads on top).
3 Ground
2 Ground 9 Ground
1 Ground
1.55 SQ
4 Input
0.1
8 Output
0.6 0.28
5 6 Ground 0.1 Ground
0.28
7 Ground
0.7
0.7 1.3
Figure 6a. PCB footprint dimensions, pad nomenclature, stencil dimensions (mm).
3
0.3 0.05
2.0 0.1[1] 1.55 0.05
4.0 0.1[2]
1.75 0.1
5.5 0.1[3] C L 3.3 0.1 1.6 0.1 12.0 0.3
R 0.3 typ 1.55 0.1 8.0 0.1 Notes: 1. Measured from centerline of sprocket hole to centerline of pocket 2. Cumulative tolerance of 10 sprocket holes is 0.20 All dimensions in millimeters unless otherwise stated. 3.3 0.1
Figure 7. Tape drawing.
13.0 0.5
179.0 1.0
60.00 0.5
1.60
Figure 8. Reel drawing.
4
REEL
Ordering Information Specify part number followed by option. For example: ACPF-7001-XXX
CARRIER TAPE USER FEED DIRECTION COVER TAPE
Notes: 1. Material polyester and acrylic adhesive layers 2. All dimensions in mm, except tape length. 3. Surface resistivity: 106 to 1012 ohms/sq
Bulk or Tape and Reel option Option Descriptions -BLK = Bulk, 100 pcs. per antistatic bag -TR1 = Tape and Reel, 1000 devices per 7" reel
Figure 9a. Device orientation in the tape.
User Feed Direction
Empty Pocket/Cavity Leader: 125 Pocket - 1 Meter Trailer: 125 Pocket - 1 Meter
11XX TXXX
11XX TXXX
11XX TXXX
Top View
End View
Figure 9b. Device orientation in the tape.
0.50 0.15 0.50 0.15 1 2
Orientation Feature 3
1.25 max
0.3 0M IN
0.35 0.15 8X
3.0 0.15 SQ 1.40 SQ 8 9 4
0.30 MIN
0.40 0.40 0.15 0.30 DIA 0.20 DIA 7 6 0.60 0.15 5 SIDE VIEW
Castellation height: 0.35 mm Total height: 1.1 mm (typ) 1.25 mm (max) Shaded region: grounded
Figure 10. Detailed bottom and side view of package (dimensions in mm).
5
Alloy type
Sn42Bi58 Sn43Pb43Bi14 Sn63Pb37 Sn60Pb40 Sn91/Zn9 Sn96.2Ag2.5Cu0.8Sb0.5 Sn95.8Ag3.5Cu0.7 Sn96.5Ag3.5 Sn100 Sn95Sb5 Sn97Cu3
Melting temp. (oC)
138 144 - 163 183 186 199 216 217 221 232 235 240
Recommended working temperature (oC)
160 - 180 165 - 185 200 - 240 200 - 240 200 - 240 235 - 255 235 - 255 240 - 260 260 - 280 260 - 280 260 - 300
Comments
Lead free Contains lead - some customers prohibit it Contains lead - some customers prohibit it Contains lead - some customers prohibit it May have oxidation problems Popular lead free composition Other alloy ratios are available Used in the assembly of filters Too hot - will melt package assembly Too hot - will melt package assembly Too hot - will melt package assembly
10 to 20 sec. 250 217C 200 235C 5C
125C 25C
60 to 120 sec.
Temperature, C
150 -6C/sec. max 3C/sec. max 100
120 sec. max. 50
Guidelines Tested profile
0 0 100 200 300 400 500 600
Time, seconds
Figure 11. Recommended solder profile.
www.agilent.com/semiconductors
For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright (c) 2003 Agilent Technologies, Inc. Obsoletes 5988-6276EN March 20, 2003 5988-8531EN

▲Up To Search▲

Price & Availability of ACPF-7001-TR1

	To Download ACPF-7001-TR1 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .